Generic hybrid FPA with indium bump bonds [7].

Hybrid UV Focal Plane Array (FPA), consisting of a back

Marcus H. Mendenhall's research works National Institute of Standards and Technology (NIST) and other places

Progress on AlGaN-based solar-blind ultraviolet photodetectors and

Considerations for Indium Bump Deposition - Denton Vacuum

Small pixel hybrid CMOS x-ray detectors (Erratum)

Generic hybrid FPA with indium bump bonds [7].

Third-generation infrared photon detectors

Fabrication of indium bumps for hybrid infrared focal plane array

Remote Sensing, Free Full-Text

Brian SIERAWSKI, Research Associate Professor, PhD Electrical Engineering, Vanderbilt University, TN, Vander Bilt, Institute for Space and Defence Electronics

Marcus H. Mendenhall's research works National Institute of Standards and Technology (NIST) and other places

PPT - CMOS Detector Technology PowerPoint Presentation, free