Details of TSFC bonding interfaces: tool/chip and bump/pad

Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates - ScienceDirect

Modeling study of thermosonic flip chip bonding process - ScienceDirect

PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

a Schematic diagram of flip-chip assembly, b flip-chip interconnect

PDF) High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux

Table I from Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

Details of TSFC bonding interfaces: tool/chip and bump/pad interface.

PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface